4 pin 3-917807-2 Connector Power Resistor Housing Wire To Board Receptacle Connectors

The advantages of ordinary pressure connections are obvious, but how to make ordinary pressure connecting and avoiding shortcomings is particularly important to minimize the pressure connection resistance. Reducing resistance means reducing fever, reducing product temperature rise, and making the product life and quality better.
Harm of terminal fever
After the terminal is heated, it is easy to oxidize itself and the wire conductive contact surface, generate oxidation layer thin film, increase the contact resistance, and increase the increase of the temperature with the temperature increase. Fire. At the same time, the elastic element of the contact structure will be annealing, the contact pressure will be reduced, and the increase of contact resistance will be further exacerbated. In addition, thermal heat will make the wire insulation layer of the connected terminal aging crisp, cause the insulation performance to decrease, and there is a risk of fire caused by leakage overheating.
As shown in Figure 2, there are three major heating sources of high -pressure line beams.
The three major heating sources of the terminal: The conductor itself has resistance. The smaller the cross -sectional area, the higher the resistance, and the resistance will cause fever.
The end of the terminal: the compression ratio is not enough, which will make the conductor loose, resulting in a large resistance and easy to fever. Excessive pressure connecting can easily cause the cross -sectional area to become smaller, and the load flow is not enough to cause fever.
Public and mother terminals are in contact with insertion: poor terminal contact, or terminal contact surface oxidation causes serious fever.
Reduce terminal temperature rise methods to reduce contact resistance: use materials with less resistance. Commonly used high -voltage terminals include H62, H65 copper or high -guide copper. Products greater than 125 A are recommended to use high -guide copper with smaller resistors. Reduce the contact resistance of the conductor. Try to compact the terminal with the conductor to reduce the pressure connection resistance. Increase the cross -sectional area of the conductor, increase the cross -sectional area, and reduce the temperature rise of the wire. Increasing the conductor heat dissipation area: use forced cooling, can use measures such as wind cooling, water cooling and other measures. Reasonable layout of the conductor, a large current beam, try to arrange it in a space that is easy to heat dissipation, which is conducive to natural heat dissipation. The pressure connection affects the pressure connection on the temperature rise, refer to the 4.2.6 voltage drop experiment in the QC/T 29106—2014 "Technical Conditions for the Car Rods" and the GB/T 20234.1-2015 " Requirements are verified by the measurement of temperature rise experiments. 

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